Maturity assessment of 300mm etch equipment

摘要

Oxide and dielectric etch, polysilicon etch, and metal etch, in situ and stand-alone ash processes for 300mm wafers were developed on a tool set in SEMICONDUCTOR300 and tested fro robustness using a 0.25um 64Mb DRAM device. The process recipes were developed from reference scaled-up recipes. The oxide and dielectric etch tools used magnetically-enhanced reactive ion etching. The polysilicon etch tool chambers were high density plasma configurations. The metal etch tools used high-density plasma chambers and have an in-line resist strip module to prevent corrosion. Stand-alone ash tools were used for all other photoresist strip processes. For each application, at least two 300mm tools from different suppliers were tested. This paper discusses process and tool interactions affecting operational robustness and stability. Process and hardware evaluations were also done during extendibility testing using smaller linewidth features.