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3.3kV IGBT Modules with Optimized Trench-Field Stop L3 and E3 Chip Technology in Industrial Drive Application

机译:具有优化的沟槽场截止L3和E3芯片技术的3.3kV IGBT模块在工业驱动应用中

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摘要

Comparing to the 2nd NPT chip technology, a new 3.3kV IGBT3 family provides two different versions of L3 and E3 chips with optimization of switching performance. The trade-off between the softness and losses of switching-off process is achieved to adapt the different applications. The maximum operational junction temperature is also extended up to 150℃ to increase the output current capability. The paper mainly compares the differences between HL3 and HE3 regarding static characteristic, switching behaviour and losses as well as safe operation area. Some lab measurements are executed to highlight and evaluate their respective advantages. The IGBT application technology in industrial drive is further discussed as well.
机译:与第二种NPT芯片技术相比,新的3.3kV IGBT3系列提供了两种不同版本的L3和E3芯片,并具有最佳的开关性能。为了适应不同的应用,实现了关闭过程的软度和损耗之间的折衷。最高工作结温也可扩展至150℃,以提高输出电流能力。本文主要比较HL3和HE3在静态特性,开关性能和损耗以及安全工作区域方面的差异。执行一些实验室测量以突出和评估它们各自的优势。还将进一步讨论IGBT在工业驱动中的应用技术。

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