首页> 外文会议>Conference on photonic and phononic crystal materials and devices IX; 20090127-29; San Jose, CA(US) >Fabrication of 3D high index photonic crystals by holographic lithography and their fidelity
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Fabrication of 3D high index photonic crystals by holographic lithography and their fidelity

机译:全息光刻技术制备3D高折射率光子晶体及其保真度

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In order to create three-dimensional (3D) photonic crystals (PCs) with large photonic bandgap properties (PBG), it is necessary to control the 3D fabrication with desired symmetry, high index contrast, and high structural stability. To rational design the 3D photonic structures fabricated by holographic lithography, we have conducted quantitative analysis to study structural distortion during each processing step and their impact to PBG. Because of the relatively low dielectric contrast between typical polymers and air, the directly patterned polymer structures are usually used as templates for backfilling of high-index materials, followed by removal of the polymer template to realize complete PBGs. Therefore, the fidelity of the final PCs is critically dependent on the thermal and mechanical robustness of the polymer templates, the deposition methods (e.g. dry chemical vapor deposition vs. wet chemistry), and the template removal procedure. Here, we address these challenges using different photoresist systems and deposition methods to create Si and titania 3D PCs.
机译:为了创建具有大光子带隙特性(PBG)的三维(3D)光子晶体(PC),必须以所需的对称性,高折射率对比度和高结构稳定性来控制3D制造。为了合理设计通过全息光刻制造的3D光子结构,我们进行了定量分析,以研究每个处理步骤中的结构变形及其对PBG的影响。由于典型的聚合物和空气之间的介电对比度较低,因此直接图案化的聚合物结构通常用作回填高折射率材料的模板,然后移除聚合物模板以实现完整的PBG。因此,最终PC的保真度主要取决于聚合物模板的热和机械强度,沉积方法(例如干化学气相沉积与湿化学)和模板去除程序。在这里,我们使用不同的光刻胶系统和沉积方法来制造Si和二氧化钛3D PC来应对这些挑战。

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