首页> 外文会议>Conference on Photon Processing in Microelectronics and Photonics Jan 21-24, 2002 San Jose, USA >Femtosecond laser machining of fluidic microchannels for miniaturized bioanalytical systems
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Femtosecond laser machining of fluidic microchannels for miniaturized bioanalytical systems

机译:飞秒激光加工微型生物分析系统的流体微通道

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Femtosecond laser ablation of borosilicate (Borofloa~(TM)) glass has been studied to machine fluidic micro-channel geometries (high aspect ratio and variable depth) not possible through traditional micro-lithographic techniques. Utilizing a 1 kHz repetition rate femtosecond laser system (Positive Light, Spitfire) and a long-working distance 5x objective lens, groove patterns 10 μm wide and as deep as 30 μm have been produced. The experiments were performed in air and the samples were cleaned after the ablation with sodium hydroxide dissolved in water to remove the debris. The substrates were mounted on a computer controlled x-y translation stage. The quality of the micro-channels showed dependency on the scanning speed of the sample. The surrounding area of the channels was smooth at scanning rates greater than 400 μm/s and smaller than 10 μm/s. Whereas, cracks appeared around the channels at scanning rates between 200 to 50 μm/s. Surface morphology is studied using optical, electron and atomic force microscopies. For a quantitative evaluation of ablation threshold and ablation rates, single-shot experiments in vacuum were performed. We found that the damage threshold for borosilicate glass is around 1.7 J/cm~2. With single pulse laser fluence of 30 J/cm~2, a 600 nm deep crater could be ablated. A ring, higher than the surface, appeared around the craters and was most probably created by adiabatic compression of glass due to the high-pressure plasma generated in the early stages of the process.
机译:飞秒激光烧蚀硼硅玻璃(Borofloa?)玻璃已被研究以加工流体微通道的几何形状(高深宽比和可变深度),这是传统微光刻技术无法实现的。利用重复频率为1 kHz的飞秒激光系统(正光,喷火)和长工作距离的5倍物镜,产生了10微米宽,深至30微米深的凹槽图案。实验在空气中进行,消融后用溶于水中的氢氧化钠清洗样品以除去碎屑。将基底安装在计算机控制的x-y平移台上。微通道的质量显示出对样品扫描速度的依赖性。通道的周围区域在大于400μm/ s和小于10μm/ s的扫描速率下是平滑的。而在通道周围以200至50μm/ s的扫描速率出现裂纹。使用光学,电子和原子力显微镜研究了表面形态。为了定量评估消融阈值和消融率,在真空中进行了单次实验。我们发现硼硅玻璃的损伤阈值约为1.7 J / cm〜2。单脉冲激光能量密度为30 J / cm〜2时,可以烧蚀600 nm深的火山口。一个比表面高的环出现在弹坑周围,并且很可能是由于在该过程的早期阶段产生的高压等离子体对玻璃进行绝热压缩而形成的。

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