首页> 外文会议>Conference on optoelectronic integrated circuits XI; 20090128-29; San Jose, CA(US) >Characterization and optimization of residual layer thickness during UV imprint process for singlemode waveguide fabrication
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Characterization and optimization of residual layer thickness during UV imprint process for singlemode waveguide fabrication

机译:单模波导制造中紫外线压印过程中残留层厚度的表征和优化

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We report on the fabrication and characterization of a residual layer resulting from UV imprinting of singlemode optical waveguide. We have measured the residual thickness formed from the imprinting process for several-um-size singlemode waveguide fabrication using the parameters of the imprinting pressure, dropped volume, and viscosity of the used polymer. We found that the residual layer thickness is dependent on both the initial polymer volume and process pressure and the initial polymer volume is more critical than process pressure. Viscosity of polymer also affects the residual layer thickness, the lowest residual layer thickness of 29nm is achieved with nano-imprinting resin, 0.3uL volume, and imprint pressure more than 20bar. Even with optical resin, the residual layer thickness of 60nm is achieved with 0.3uL volume and imprinting pressure of 30bar.
机译:我们报告了由单模光波导的紫外线压印导致的残留层的制造和表征。我们已经使用压印压力,液滴体积和所用聚合物的粘度等参数,测量了由压印工艺形成的几微米尺寸单模波导制造过程中残留的厚度。我们发现残余层厚度取决于初始聚合物体积和工艺压力,并且初始聚合物体积比工艺压力更关键。聚合物的粘度也会影响残留层的厚度,使用纳米压印树脂,0.3uL的体积和大于20bar的压印压力,可以获得最低的残留层厚度为29nm。即使使用光学树脂,在0.3uL的体积和30bar的压印压力下也可实现60nm的残留层厚度。

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