首页> 外文会议>Conference on Optical Tomography and Spectroscopy of Tissue V Jan 26-29, 2003 San Jose, California, USA >Angular Domain Optical Imaging of Structures Within Highly Scattering Material Using Silicon Micromachined Collimating Arrays
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Angular Domain Optical Imaging of Structures Within Highly Scattering Material Using Silicon Micromachined Collimating Arrays

机译:使用硅微机械准直阵列对高散射材料中的结构进行角域光学成像

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Optically Tomography within highly scattering material has focused on Coherence Domain and Time Domain methods: both detecting the shortest path photons over the dominant randomly scattered background light. Angular Domain Imaging instead uses collimators, small acceptance angle filters, to observe only those photons closely aligned to a laser light source. A linear collimating array was fabricated using silicon surface micromachining consisting of 51 μm wide by 10 mm long etched channels with 102 μm spacing very high aspect ratio (200:1) 20 mm wide array. With careful array alignment to a laser source, restricted to a linear beam, the unscattered laser light passes directly through the channels to a CCD detector, and the channel walls absorb the scattered light at angles >0.29 degrees. With a computer controlled Z axis objects within a 1 cm thick scattering material were scanned quickly. High contrast 150 μm lines/spaces at the medium front were observed at scattered to ballistic photon ratios >5x10~5:1 with a 10 mm beam. Narrowing the beam to 130 μm width produces detectable images >3x10~8:1. Objects closer to the detector were more visible, and mid point objects were detectable >10~9:1. Smaller channels and longer arrays should enhance detection by factors of > 100.
机译:高散射材料中的光学层析成像技术着重于相干域和时域方法:都在主要的随机散射背景光上检测最短路径的光子。 Angular Domain Imaging使用准直仪,小的接收角滤光片来观察仅与激光光源紧密对准的那些光子。使用硅表面微加工制造线性准直阵列,该表面由51μm宽乘10 mm长的蚀刻通道组成,间距为102μm,非常高的长宽比(200:1)20 mm宽阵列。通过对激光源进行仔细的阵列对准(仅限于线性光束),未散射的激光直接通过通道到达CCD检测器,通道壁以大于0.29度的角度吸收散射光。使用计算机控制的Z轴,可以快速扫描1厘米厚散射材料内的对象。在10 mm的光束下,在散射与弹道光子之比> 5x10〜5:1的情况下,观察到了中等对比度的高对比度150μm线/空间。将光束缩小到130μm的宽度会产生可检测的图像,其> 3x10〜8:1。靠近探测器的物体更明显,而中点物体的可探测> 10〜9:1。较小的通道和较长的阵列应将检测强度提高> 100。

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