首页> 外文会议>Conference on Micro- and Nanoelectronics; 20031006-20031010; Zvenigorod; RU >Dry Cleaning of Fluorocarbon Residues by Atomic Hydrogen Flow
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Dry Cleaning of Fluorocarbon Residues by Atomic Hydrogen Flow

机译:氢原子流干洗碳氟化合物

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Successful removal of fluorocarbon residues on silicon structure using neutral atomic hydrogen direct flow is reported. It has been stated that the treatment of samples in atomic hydrogen direct flow of density of 2x10~(15) at. cm~(-2) s~(-1) leads to decreasing of fluorocarbon residues concentration on the surface of structure by 5 orders of magnitude. The concentration of fluorocarbon residues after AH treatment is at the hum level characteristic for the absolutely clean surface exposed in atmosphere air. Removal fluorocarbon residues is being realized at temperature of 20-100° both from the planar surface of a structure and from the sidewalls and bottom of the contact holes with diameter of 0.3-0.25 μm and depth of 1.2-1 μm. The time of treatment as 2 min is quite sufficient for fluorocarbon residues removal.
机译:据报道,使用中性原子氢直接流成功去除了硅结构上的碳氟化合物残留物。据指出,样品在原子氢直接处理中的密度为2x10〜(15)at。 cm〜(-2)s〜(-1)导致结构表面的碳氟化合物残留浓度降低了5个数量级。 AH处理后的碳氟化合物残留物浓度处于暴露在大气中的绝对清洁表面的嗡嗡声水平。从结构的平面表面和直径为0.3-0.25μm,深度为1.2-1μm的接触孔的侧壁和底部都可以在20-100°的温度下去除碳氟化合物残留物。 2分钟的处理时间足以去除碳氟化合物残留物。

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