首页> 外文会议>Conference on Materials for Infrared Detectors II, Jul 8-9, 2002, Seattle, Washington, USA >The Influence of Photoresist Feature Geometry on ECR Plasma Etched HgCdTe Trenches
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The Influence of Photoresist Feature Geometry on ECR Plasma Etched HgCdTe Trenches

机译:光刻胶特征几何形状对ECR等离子体刻蚀HgCdTe沟槽的影响

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摘要

Factors that affect width and aspect ratio in electron cyclotron resonance (ECR) etched HgCdTe trenches are investigated. The ECR etch bias and anisotropy are determined by photoresist feature erosion rate. The physical characteristics of the trenches are attributed to ECR plasma etch chemistry.
机译:研究了影响电子回旋共振(ECR)蚀刻的HgCdTe沟槽的宽度和纵横比的因素。 ECR蚀刻偏差和各向异性是由光刻胶特征腐蚀速率决定的。沟槽的物理特性归因于ECR等离子体蚀刻化学。

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