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Computational imaging of defects in commercial substrates for electronic and photonic devices

机译:电子和光子设备商用基板中缺陷的计算成像

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Computational defect imaging has been performed in commercial substrates for electronic and photonic devices by combining the transmission profile acquired with an imaging type of linear polariscope and the computational algorithm to extract a small amount of birefringence. The computational images of phase retardation 5 exhibited spatial inhomogeneity of defect-induced birefringence in GaP, LiNbO_3, and SiC substrates, which were not detected by conventional 'visual inspection' based on simple optical refraction or transmission because of poor sensitivity. The typical imaging time was less than 30 seconds for 3-inch diameter substrate with the spatial resolution of 200 μm, while that by scanning polariscope was 2 hours to get the same spatial resolution. Since our proposed technique have been achieved high sensitivity, short imaging time, and wide coverage of substrate materials, which are practical advantages over the laboratory-scale apparatus such as X-ray topography and electron microscope, it is useful for nondestructive inspection of various commercial substrates in production of electronic and photonic devices.
机译:通过将获取的透射轮廓与成像型线性偏光镜和计算算法相结合以提取少量的双折射,已经在用于电子和光子设备的商用基板中执行了计算缺陷成像。相位延迟5的计算图像在GaP,LiNbO_3和SiC衬底中表现出缺陷引起的双折射在空间上的不均匀性,由于灵敏度低,传统的“目视检查”基于简单的光学折射或透射无法检测到这些缺陷。对于直径为3英寸的基板,其空间分辨率为200μm的典型成像时间少于30秒,而通过扫描偏光镜获得的空间分辨率为2小时。由于已经实现了我们提出的技术,灵敏度高,成像时间短,基材材料的覆盖范围广,相对于实验室规模的设备(如X射线形貌图和电子显微镜)具有实际优势,因此可用于各种商用无损检测电子和光子设备生产中的基板。

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