Department of Mechanical Engineering, Doshisha University 1-3 Tataramiyakodani, Kyotanabe-shi, Kyoto 610-0394, Japan;
Department of Mechanical Engineering, Doshisha University 1-3 Tataramiyakodani, Kyotanabe-shi, Kyoto 610-0394, Japan;
Department of Mechanical Engineering, Doshisha University 1-3 Tataramiyakodani, Kyotanabe-shi, Kyoto 610-0394, Japan;
Department of Mechanical Systems Engineering, The University of Shiga Prefecture 2500, Hassaka-cho, Hikone-shi, Shiga 522-8533, Japan;
Department of Mechanical Engineering, Doshisha University 1-3 Tataramiyakodani, Kyotanabe-shi, Kyoto 610-0394, Japan;
机译:柔性印刷电路板微钻的刀具磨损特性及其对微孔质量的影响
机译:复合印刷电路板高速微钻孔过程中钻头尺寸对耦合振动的影响
机译:硬质合金微钻和印刷电路板在微钻过程中的相互作用
机译:用于预测含有高硬度填料的印刷电路板微钻孔钻磨床的实用配方
机译:通过高阶光谱在线监测钻头磨损,以生产印刷电路板。
机译:为低压可穿戴传感器应用而优化的超薄印刷有机TFT CMOS逻辑电路的制造
机译:高速微钻柔性印刷电路板切削力的试验研究
机译:印刷电路板计算机辅助设计工具(基于Tektronix 4051)和数控纸带控制钻床之间的接口(slo-syn 530:100 W / Dumore自动头编号8391)