首页> 外文会议>Annual International Conference on Compound Semiconductor MANufacturing TECHnology(CS MANTECH); 20060425-27; Vancouver(CA) >Preliminary Results from Phase Ⅱ of the Wide Bandgap Semiconductor for RF Applications (WBGS-RF) Program
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Preliminary Results from Phase Ⅱ of the Wide Bandgap Semiconductor for RF Applications (WBGS-RF) Program

机译:宽带隙半导体射频应用(WBGS-RF)计划第二阶段的初步结果

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This paper details the latest progress in the Wide Bandgap Semiconductors for RF Applications (WBGS-RF) program sponsored by the Microsystems Technology Office of the Defense Advanced Research Projects Agency (DARPA/MTO). While the first phase of WBGS-RF focused on semi-insulating substrates and epitaxial growth, this phase pushes new RF capabilities in wide bandgap device fabrication, showing improvements in power-added efficiency, gain, bandwidth, power density and reliability of wide bandgap RF power devices. Although this report gives initial DC and RF test results from sample devices, further improvement is expected as this phase of the program progresses.
机译:本文详细介绍了由国防高级研究计划局(DARPA / MTO)的微系统技术办公室赞助的RF应用宽带隙半导体(WBGS-RF)计划的最新进展。 WBGS-RF的第一阶段专注于半绝缘基板和外延生长,这一阶段推动了宽带隙器件制造中的新RF功能,显示出宽带隙RF的功率附加效率,增益,带宽,功率密度和可靠性得到了改善电源设备。尽管此报告提供了来自示例设备的初始DC和RF测试结果,但是随着该程序阶段的进展,预计还会有进一步的改进。

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