A Chemical and Thermal Resistant Wafer Bonding Adhesive Simplifying Wafer Backside Processing

摘要

A variety of adhesives have been demonstrated for use in thinning and backside processing of Ⅲ-Ⅴ substrates.~(1-4) Each process exhibits certain limitations based on the adhesive's chemical or thermal resistance. As a result, an adhesive's property limitation may drive up costs or reduce throughput by necessitating the use of additional protective aids or special tooling. A new product developed by Brewer Science, Inc. (BSI), WaferBOND~(TM)~5 adhesive, eliminates the need for such aids by directly simplifying the process. WaferBOND~(TM) adhesive exhibits an unusually high resistance to process conditions, which enables the use of strong acids and bases, stripping solvents, and temperatures in excess of 200℃. Applied with conventional spin-on equipment, the material coats with exceptional uniformity ( < 0.3% TTV), cures and bonds at relatively low temperatures, and demounts in corrosion-safe chemistries in times that are substantially lower than the competition, which allow an increase in throughput. This paper discusses the benefits of the WaferBOND~(TM) adhesive mounting product and the ease of integrating it into an existing process line.