Statistical Quality Control of Wafer Level DC Die Sort Test

摘要

In this report, we developed a statistical quality control (SQC) system associated in our test programs to control wafer level DC Die Sort test by providing controls over TRI failures, bin yield loss and mean and standard deviation variances of key parameters. This SQC system has dramatically reduced the test caused yield loss ～1.2% since the tool was implemented. The yield excursions have been captured in real-time from the control of bin yields and variability of the critical parameters. Productivity is also greatly improved by integrating automated recipe downloading and TRI re-test as well as Die Sort disposition decision making into the process.