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首页> 外文会议>American Society of Mechanical Engineers(ASME)/Pacific RIM Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 pt.B; 20050717-22; San Francisco,CA(US) >USE OF ARRAY CAPACITORS TO IMPROVE THE POWER DELIVERY PERFORMANCE OF A MICROPROCESSOR SYSTEM
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USE OF ARRAY CAPACITORS TO IMPROVE THE POWER DELIVERY PERFORMANCE OF A MICROPROCESSOR SYSTEM

机译：使用阵列电容器改善微处理机系统的功率传递性能

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摘要

We show system modeling and measurement results of a platform with array capacitor solution (ACS) within the frequency domain. A Pentium® 4 microprocessor package was redesigned for a single array capacitor, in place of all multi-terminal capacitors. Its system power delivery impedance profile was found to have a more desirable high frequency response than the earlier system designed with discrete multi-terminal capacitors. These measured results were also found to agree well with the behavior predicted by simulation models. Additionally we explore the impact and optimization of array capacitor parameters on the overall system frequency response.
机译：我们显示了在频域内具有阵列电容器解决方案（ACS）的平台的系统建模和测量结果。对Pentium®4微处理器封装进行了重新设计，以取代所有多端电容器，从而用于单个阵列电容器。发现其系统功率传输阻抗曲线具有比设计有离散多端子电容器的早期系统更理想的高频响应。还发现这些测量结果与仿真模型预测的行为非常吻合。此外，我们探索了阵列电容器参数对整个系统频率响应的影响和优化。

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