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MODELING SQUEEZE-FILM DAMPING OF ELECTROSTATICALLY ACTUATED MICROPLATES UNDERGOING LARGE DEFLECTIONS

机译:承受大挠度的静电致动微孔板的挤压膜阻尼建模

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摘要

A model for the dynamics of electrostatically actuated microplates undergoing large deflections under the effect of squeeze-film damping is presented. The model predicts the quality factors of microplates under a wide range of gas pressures and applied electrostatic forces up to the pull-in instability. The model utilizes the nonlinear Euler-Bernoulli beam equation, the von Karman plate equations, and the compressible Reynolds equation. The static deflection of the microplate is calculated using the beam model. Analytical expressions are derived for the pressure distribution in terms of the plate mode shapes around the deflected position using perturbation techniques. The static deflection and the analytical expressions are substituted into the plate equations, which are solved using a finite-element method. Several results are presented showing the effect of the pressure and the electrostatic force on the structural mode shapes, the pressure distributions, the natural frequencies, and the quality factors.
机译:提出了在挤压膜阻尼作用下发生大挠度的静电微板动力学模型。该模型可预测在各种气体压力和施加的静电力到拉入不稳定性的情况下微孔板的品质因数。该模型利用了非线性Euler-Bernoulli梁方程,von Karman板方程和可压缩Reynolds方程。使用光束模型计算微孔板的静态挠度。使用扰动技术,根据偏转位置附近的板模式形状得出了压力分布的解析表达式。静挠度和解析表达式被代入板式方程,使用有限元法求解。给出了几个结果,这些结果显示了压力和静电力对结构模式形状,压力分布,固有频率和品质因数的影响。

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