Department of Power Mechanical Engineering, National Tsing Hua University,Hsinchu, Taiwan, R. O. C.;
Department of Power Mechanical Engineering, National Tsing Hua University,Hsinchu, Taiwan, R. O. C.;
Department of Power Mechanical Engineering, National Tsing Hua University,Hsinchu, Taiwan, R. O. C.;
Department of Power Mechanical Engineering, National Tsing Hua University,Hsinchu, Taiwan, R. O. C.;
chemical mechanical polishing; pad conditioning; cost of consumable;
机译:Cmp垫寿命及其力学性能的研究
机译:CMP垫的力学性能研究
机译:CMP垫聚合物中水扩散的定量及其对机械性能的影响
机译:用机械性能研究CMP垫寿命
机译:焊盘设计对化学机械平面化(CMP)性能的影响。
机译:基于家用猫爪子垫的机械性能的非气轮辐射减振方法研究
机译:用于氧化物CMP应用的软化学机械抛光垫