Modeling of Heat Transfer in Microchannels of a CPU - Heat Sink Cooling System

摘要

Electronic equipment cooling processes require development of more and more complex systems. In order to achieve adequate cooling, phenomena like Joule Thomson, Peltier or the thermal tube principle are now employed. Correct Central processing unit (CPU) functioning imposes use of efficient heat exchangers. Experimental investigations showed a different behavior for heat radiators, depending on the flow channels configuration and chosen route for the air circulated by the system fan. For the present study, the adopted mathematical model takes into consideration several aspects, such as flow regime, air viscosity, microchannel physical parameters and characteristics of CPU-cooler interface material. Temperature variations in CPU area were analytically calculated starting from a Holman model, completed by resolution of Fourier equations for a stationary unidirectional regime, with parallel flat walls, and internal heat sources. The CPU was assumed to generate all the heat. A CPU cooling system behavior was investigated using a heat transfer model, created in ANSYS, for the above-mentioned conditions.