Institute of Photonics and Quantum Electronics (IPQ), Karlsruhe Institute of Technology (KIT), Engesserstr. 5, 76131 Karlsruhe Germany,Institute of Microstructure Technology (IMT), Karlsruhe Institute of Technology (KIT), Hermann-von-Helmholtz-Platz 1, 76344 Eggenstein-Leopoldshafen, Germany;
Institute of Photonics and Quantum Electronics (IPQ), Karlsruhe Institute of Technology (KIT), Engesserstr. 5, 76131 Karlsruhe Germany,Institute of Microstructure Technology (IMT), Karlsruhe Institute of Technology (KIT), Hermann-von-Helmholtz-Platz 1, 76344 Eggenstein-Leopoldshafen, Germany;
Institute of Photonics and Quantum Electronics (IPQ), Karlsruhe Institute of Technology (KIT), Engesserstr. 5, 76131 Karlsruhe Germany,Institute of Microstructure Technology (IMT), Karlsruhe Institute of Technology (KIT), Hermann-von-Helmholtz-Platz 1, 76344 Eggenstein-Leopoldshafen, Germany;
Institute of Photonics and Quantum Electronics (IPQ), Karlsruhe Institute of Technology (KIT), Engesserstr. 5, 76131 Karlsruhe Germany;
Institute of Photonics and Quantum Electronics (IPQ), Karlsruhe Institute of Technology (KIT), Engesserstr. 5, 76131 Karlsruhe Germany;
Institute of Photonics and Quantum Electronics (IPQ), Karlsruhe Institute of Technology (KIT), Engesserstr. 5, 76131 Karlsruhe Germany;
Institute of Photonics and Quantum Electronics (IPQ), Karlsruhe Institute of Technology (KIT), Engesserstr. 5, 76131 Karlsruhe Germany;
Institute of Photonics and Quantum Electronics (IPQ), Karlsruhe Institute of Technology (KIT), Engesserstr. 5, 76131 Karlsruhe Germany;
Institute of Photonics and Quantum Electronics (IPQ), Karlsruhe Institute of Technology (KIT), Engesserstr. 5, 76131 Karlsruhe Germany;
Institute of Photonics and Quantum Electronics (IPQ), Karlsruhe Institute of Technology (KIT), Engesserstr. 5, 76131 Karlsruhe Germany;
Institute of Photonics and Quantum Electronics (IPQ), Karlsruhe Institute of Technology (KIT), Engesserstr. 5, 76131 Karlsruhe Germany;
Photonic integration; two-photon polymerization; photonic wire bonding; silicon photonics; optical packaging; multi-chip integration; direct laser writing; 3D nanofabrication;
机译:自由空间光子线键在单独的芯片上连接III-V和SI光子电源
机译:通过光子引线键合将硅光子电路连接到多芯光纤
机译:用于膜光子电路的具有苯并环丁烯粘合晶片键合的Si衬底上的低损耗GalnAsP线波导
机译:光子引线键合:在芯片边界上连接纳米光电电路
机译:低色散,高光谱效率,RF光子传输系统和低损耗光栅耦合器,用于绝缘体上硅纳米光子集成电路。
机译:通过纳米光子掩盖增加无源光子集成电路的密度
机译:通过光子引线键合将硅光子电路连接到多芯纤维