Chip-printed circuit board-arrangement, has passivation layer arranged next to electrical connecting contact, and wire bonding connection with wire connected with contact surface of board by electrically conductive material

摘要

The arrangement has a passivation layer (13) arranged next to an electrical connecting contact (12). A wire bonding connection (15) with a bonding wire (16) is provided on the contact of a semiconductor chip (11), where the wire ends at the passivation layer. The bonding wire is connected with a contact surface (18) of a printed circuit board (19) by an electrically conductive material (17) e.g. soldered strut. The passivation layer includes an adherent surface for wire bonding. An intermediate layer (14) is arranged on the passivation layer, and includes an elastic material. An independent claim is also included for a method for manufacturing a chip printed circuit board arrangement.