HOT MELT ADHESIVES FOR THE ASSEMBLY OF MEMS AND MICROELECTRONICS

摘要

The bonding experiments with hot melt adhesives present a new joining technique for the application of microsystem parts. The main advantage of this adhesive system is, that it allows joining smallest geometries ( 200 μm) with minimum doses of adhesives. The processing time of about 1 s is the other advantage. This is the time which is needed until the joining connection has handling strength. These are important differences to the presently used viscous adhesive systems. In first industrial projects hot melt adhesives were used. A developed application ("hybrid-bonding") is the fixing of microparts by hot melts. In a second process step a bonding (e. g. underfill) with a viscous adhesive was used to get a maximum strength for the bond.