Efficient Design Practices for Thermal Management of a TSV Based 3D IC System

摘要

Peak temperature, local hotspots, and thermal gradients became critical issues with higher localizedrncurrent densities resulting from the combination of higher performance and further devicernminiaturization. 3D vertical integration utilizing VIA first/VIA early technologies exacerbated thatrnproblem by the interaction of inter-die heat sources and three-dimensional thermal gradients. Onernof the main proposed solutions for managing thermal issues in TSV based 3D integrated chips isrnthe use of Thermal TSVs. In this talk I will cover the basics of the thermal issues with transitionrnfrom 2D to 3D integration. Then I will focus on good first order design practices that will enablernthe designer using basic thermal simulations, physics based common sense, and some basic rules ofrnthumb to avoid unacceptable thermal gradients in his/her 3D TSV based placement and integration.