DEVELOPMENT OF BUILD-UP PROCESS FOR MULTI LAYER BOARD USING RAPID PROTOTYPING

摘要

As CAD/CAM technologies become more developed, rapid prototyping technology is being widely used for checking designs, to create master models for rapid tooling, and for reverse engineering. For some equipments such as FDM and SGC, support materials different from the models are used in order to easily separate the model from the working plate. However in general a model created by rapid prototyping technology only consists of a single material. Using screen printing technology and solid ground curing, an experiment was conducted to develop a rapid prototyping technology that can create a model with two or more materials for the model itself. As for the material, a photo/thermal curable resin and a conductive paste are used for the formation of a dielectric and a conductor. The basic concept and the possibility of Multi Layer Board(MLB) prototyping is proposed in this study and compared to that of the conventional rapid prototyping process.