NON-CONTACT HANDLING OF WAFERS AND MICROPARTS USING ULTRASONICS

摘要

The requirements needing to be met by handling technologies in semiconductor fabricationrnand microsystem technology are rising relentlessly. Miniaturized, fragile and surfacesensitiverncomponents call for new, innovative approaches. An interesting option is to usernhigh-intensity ultrasonics as a non-contact means of handling microparts and substrates.rnWhile microparts can be manipulated in standing waves, it is the near field of ultrasonicrnsources which forms the basis for the handling of wafers. This enables the developmentrnof non-tactile grippers and transfer systems for material flow purposes in semi-conductorrnfabrication and wafer-based microsystem technology. The piezo-electric sound transducersrnused in this process not only enable the non-contact application of force but also permitrnconclusions to be drawn about these forces by measuring electric variables. Systemrnmonitoring is also possible with this concept.