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CUSTOMER SPECIFIC MEMS DEVELOPMENT AND FOUNDRY SERVICE FROM TRONIC'S MICROSYSTEMS

机译:TRONIC的微系统为客户量身定制的MEMS开发和基础服务

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摘要

Since its creation in 1997 as a spin off from CEA LETI, Tronic's Microsystems has focused its effort in offering to O.E.M. (Original Equipment Manufacturer) customers, foundry services based on strong technology building blocks around thick SOI (Silicon On Insulator) wafers surface and bulk micromachining. Its expertise in releasing thick complex moveable structures, grown by epitaxy of single crystalline silicon active layer or from bonded SOI wafer, allows engineers to imagine designs using interdigitated comb, membrane or cantilever beam combined with various detection and actuation principles. Thus, the company has been able to serve gradually various high-end markets by providing MEMS (Micro Electro Mechanical System) components such as sensors, optical MEMS, RF MEMS (Radio Frequency MEMS) and microfluidics components, bringing innovative microsystems design from concept to volume production. All steps of the development cycle are fully covered by Tronic's in full compliance with ISO 9001; from co-design capability to full volume production including development and industrialisation phases. At the early stage, the prototyping process is particularly effective due to a good preparation of feasability and prototyping runs. The use of MEMSOI Multi Project Wafer offer (MPW) and the Multi Parameter Design Custom Wafer offer (MPDCW) reinforce the capacity of customer to issue cost competitive readily useable designs. The technology MEMS toolbox includes not only industry standard in photolithography, material deposition, wet and dry etching including DRIE (Deep Reactive Ion Etching) but also wafer bonding, wafer level packaging and test. Tronic's has successfully practised up to now, two business models depending on volume perspective; 1. contract agreement starting at prototype stage or including development from design to series manufacturing 2. for very large scale ultimate production, the same previous offer can potentially lead to a contract technology transfer with a second source positioning In all cases, a close partnership with customer, either leader corporation or innovative start-up company, is the key factor for quick and effective achievement.
机译:自1997年从CEA LETI衍生出来成立以来,Tronic的Microsystems一直致力于为O.E.M.提供产品。 (原始设备制造商)客户,基于强大技术构建块的铸造服务,这些构建块围绕厚SOI(绝缘体上硅)晶片表面和批量微机械加工。它具有释放单晶硅有源层外延生长或从键合SOI晶片上生长的复杂的可移动结构的专业知识,使工程师们可以想象结合叉指,膜或悬臂梁并结合各种检测和驱动原理的设计。因此,该公司能够通过提供MEMS(微机电系统)组件(例如传感器,光学MEMS,RF MEMS(射频MEMS)和微流体组件)来逐步服务于各种高端市场,从而将创新的微系统设计从概念带入量产。 Tronic完全符合ISO 9001的要求,涵盖了开发周期的所有步骤;从协同设计能力到包括开发和工业化阶段的批量生产。在早期阶段,由于对可行性和原型运行的良好准备,原型制作过程特别有效。 MEMSOI多项目晶圆产品(MPW)和多参数设计定制晶圆产品(MPDCW)的使用增强了客户发布具有成本竞争力且易于使用的设计的能力。 MEMS技术工具箱不仅包括光刻,材料沉积,湿法和干法蚀刻(包括DRIE(深反应离子蚀刻))的行业标准,还包括晶圆键合,晶圆级封装和测试。 Tronic's迄今已成功地实践了两种业务模型,具体取决于数量角度; 1.合同协议从原型阶段开始,或包括从设计到批量生产的开发。2.对于大规模最终生产,相同的先前报价可能会导致合同技术转让,而第二来源的定位在所有情况下都与客户,无论是领导者公司还是创新型初创公司,都是实现快速有效成就的关键因素。

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