Millimeter-Wave Wireless Intra-/Inter Chip Communications in 3D Integrated Circuits Using Through Glass Via (TGV) Disc-Loaded Patch Antennas

摘要

A Through Glass Via (TGV) disc-loaded patch antenna is integrated in a glass interposer layer for millimeter-wave intra-/inter chip wireless communication applications in W-band (75GHz -- 110GHz). The circular disc on the bottom side is utilized as a main radiator (patch antenna) and the TGV is for a vertical feeding line connected to the coplanar waveguide (CPW) on the top side of the glass substrate. A broadside radiation pattern formed by the circular patch antenna enables out-of-plane wireless communications whose distance would be a few mm to a few cm. By using such a wireless interconnect approach, problems such as cross talk and time delay associated with the conventional wired interconnects could be reduced. A TGV fed patch antenna is designed and fabricated, which shows a return loss of 20.88 dB at 84.8 GHz, a 10 dB bandwidth of 31.3 % (80.39 GHz to 107.06 GHz). The measured results are matched well with the simulation ones. The simulated peak gain of the antenna is 3.14 dBi.