Forward Tactile Sensing Device Development and Biopackaging for Endovasular Guidewire Intervention Application

摘要

Revascularization procedure for peripheral artery disease is dependent on surgeon's skill and experience for a successful procedure. An integrated sensor on guidewire is proposed to reduce such dependency during the procedure. The development and packaging of the sensor with a hybrid-silicone-polymer substrate (HSPS) and a silicon stopper arepresented in this paper. A compact HSPS (0.4mm x 10mm x0.31mm) with trace width/spacing of 20μm/20μm for five output signals and Si stopper with safety displacement feature to prevent force overloading are fabricated. It is able to enhanced current sensor integrated guidewire by improving the robustness and provides a forward sensing mechanism (orthogonal assembly). The assembled device is able to measure up till 42mN force with a resolution of 0.2mN. Detail of characterization testing and result will be presented in the paper.