Novel Multi Chip Packaging Method Using Stochastic Self Assembly

摘要

The objective of this project was to apply a self-assembly process in the development of a functional battery assistedrnpassive (BAP) tag. A multifunctional sensor using RF signals was designed and fabricated. Multiple ASICrnand OTS IC dice were placed in a multi layer flexible carrier by applying a self assembly method and packaged tornarchive inexpensive micro sensors. The interconnections were made using printable conductive inks to replacernpreviously used thin film processes and to reduce costs. This flexible package consists of more than one polymerrnsubstrate with the devices embedded in it and connected to each other and are finally covered by polymeric planarizationrnlayers where the traces are printed on leading to the package terminal of the device.rnThe RF system can receive an RF signal, store the required info, and respond to stored information when proddedrnto do so through an RF signal. The flexible package consists of a polymer substrate with the device embedded in itrnand covered by a polymer. The polymer cover layer protects and sandwiches the device between the substrate andrnitself. The interconnection from the chips to the package terminals is provided using vias in the cover-lay polymer.rnThe package terminals on the cover-lay surface interconnect with the device through the vias in the cover-lay overrnthe terminals on the device. Metallization is accomplished using a photolithography process.