Laser Scribing of Copper/Low-k Dielectric Semiconductor Materials by Nanosecond and Ultrafast Pulsewidth Lasers

摘要

The adoption of copper/low-k technology into semiconductor devices has created new challenges for mechanicalrndicing. Low-k dielectrics are less mechanically strong compared to SiO_2, making these layers susceptible tornchipping, cracking, and delamination during saw dicing. Laser scribing or dicing of these devices offers a possiblernsolution. Because the absorption of laser energy is dependent on the materials and layer thicknesses in arnsemiconductor stack, careful selection of the laser parameters are important for laser processing. This presentationrnprovides a comparison of laser processing of copper/Black Diamond low-k materials using nanosecond andrnultrafast pulsewidth lasers.