APPARATUS FOR LASER SCRIBING A PATTERN OF GROOVES USING A PLURALITY OF INDEPENDENTLY SCANNED LASER BEAMS ON DIELECTRIC COATED SEMICONDUCTOR MATERIAL

摘要

A groove pattern is scribed into a silicon-nitride layer on a silicon wafer (12) using four independently scanned, focused beams (44 A-D) of laser radiation. Each focused beam (44A, 44B, 44C, 44D) is scannable within one of four scan- field positions on a turntable (34). The wafer (12) is transported incrementally from the first scan-field position (38) to the second (37), third (38) and fourth (39) scan-field positions. The scanned focused laser beam (44A-D) in each scan-field position (36-38) scribes a portion of the groove pattern on the wafer (12), with scribing of the groove pattern being completed at the fourth (39) scan-field position.