Embedding the Footprint into Very High Frequency Surface Mount Components through De-embedding Optimization

摘要

As Multiple decade GHz RF applications become more common place mass production approaches thesernapplications in component forms that require low cost production processes. These standard mass production processesrninclude both LGA and BGA component mounting processes. Advanced design techniques are required to creaternsuccessful implementations of component performance criteria including the PCB footprint. Through accurate diernsimulation and characterized interconnecting structures extended into the uniform transmission line environment of thernPCB. A sufficiently predistorted die function can be achieved through simulated optimization with de-embeddingrncomponents in line with the simulated device under test. This has been empirically demonstrated through many 20GHzrnplus passive filter structures. Furthermore these BGA footprints have demonstrated very stable performance and nestingrntolerances are held low through strict surface mount manufacturing process definitions and controls.