Characterization of Flip Chip Joints Using Temperature Cycling and Surface Insulation Resistance Testing (SIR)

摘要

Flip chip utilization sets high demands on the qualification of the materials and process sequipment. Therefore the technology intended for mass production is evaluated by temperature cycling. Test chips were placed using an SMD (surface mounted device) placement machine with flip chip option. The reflow curve was similar to that used in normal SMD production. The effect of stand-off depending on the size of flip chip pads was characterized. In the test two different bumping technologies were compared. The flux used for joining was evaluated by using the surface insulation resistance (SIR) test.