首页> 外文会议>32nd European Solid-State Device Research Conference (ESSDERC 2002), Sep 24-26, 2002, Firenze, Italy >Understanding nMOSFET characteristics after soft breakdown and their dependence on the breakdown location
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Understanding nMOSFET characteristics after soft breakdown and their dependence on the breakdown location

机译:了解软击穿后的nMOSFET特性及其对击穿位置的依赖性

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Identical breakdown-position dependence of normalized currents in nFETs with 2.4 nm gate oxide is observed after soft and hard breakdowns. This suggests that electron energy is conserved in the soft breakdown path. It is concluded that the observed soft breakdown is best modeled by a lowered oxide barrier in the breakdown conduction path. The static behavior of an nFET immediately after SBD is discussed and tested using the MEDICI device simulator.
机译:在软击穿和硬击穿之后,观察到具有2.4 nm栅极氧化物的nFET中归一化电流的击穿位置相关性相同。这表明在软击穿路径中电子能量是守恒的。结论是,观察到的软击穿最好通过击穿传导路径中降低的氧化物势垒来建模。使用MEDICI器件模拟器讨论并测试了SBD之后nFET的静态行为。

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