Synchronization of Information Flow with Material Flow for IC Packaging CIM

摘要

The aim of this paper is to study a key point for Computer Integrated Manufacturing(CIM) of semiconductor packaging process: synchronization of information flow with material flow. Most IC packaging companies have installed MES and other CIM systems, but few of them have achieved what they had expected. The main reason is that the information flow managed by CIM system hasn't been synchronized with material flow on the shop floor. The data for MES and other CIM systems is not collected at the right time and at the right place. The synchronization is even more important for. packaging because the lead time of the packaging process is only a few days and the volume of material is quite large.rnIn this paper, a work flow model is proposed to synchronize the information flow with the material flow. Firstly, a typical IC packaging process and its process steps have been investigated. A material flow model is created torndescribe the movement of material and product on the shop floor. Secondly, the information flow model is used to specify what are the input data and output data for each operation or machine. Thirdly, a work flow model is created to define the "who", "when", "where", "how" and "what" on the shop floor of packaging process. The "what" includes "what" material and "what" information for each operation. Lastly, on the basis of the work flow model, an integrated architecture of Manufacturing Execution Systems is designed. The information flow of all MES functions, whether automatic or manual, should be synchronized with the physical material flow. In this way, MES could be successfully implemented on the shop floor of IC packaging.