首页> 外文会议>28th International Symposium for Testing and Failure Analysis, Nov 3-7, 2002, Phoenix, Arizona >Defect Localization Using Time-Resolved Photon Emission on SOI Devices that Fail Scan Tests
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Defect Localization Using Time-Resolved Photon Emission on SOI Devices that Fail Scan Tests

机译:在扫描测试失败的SOI设备上使用时间分辨的光子发射进行缺陷定位

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from the optical waveform evidence was that an open must exist between "A" and the NAND gate. As shown in Figure 14, an open metal line was discovered in the SEM. Further investigation revealed that incorrect bum-in code allowed several select lines on the mux to be simultaneously activated. This condition created high currents at the NAND gate output, which caused electromigration.
机译:从光波形的证据来看,“ A”与“与非”门之间必须存在开路。如图14所示,在SEM中发现了一条开放的金属线。进一步的调查表明,错误的启动代码使多路复用器上的多条选择线被同时激活。这种情况会在“与非”门输出端产生高电流,从而引起电迁移。

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