Transparent Heat Spreader for Backside Optical Analysis of High Power Microprocessors

摘要

The development of the diamond window-based transparent heat spreader has allowed infrared probing and analysis tools to be applied to high-power microprocessors. We have acquired waveforms on advanced microprocessors generating over 70 W while maintaining acceptable die temperatures and thermal gradients. The transparent heat spreader technology is a critical solution for optical probing on high-power processors.