首页> 外文会议>23rd European Mask and Lithography Conference(EMLC 2007); Proceedings of SPIE-The International Society for Optical Engineering; vol.6533 >Benchmark and gap analysis of current mask carriers vs future requirements: example of the carrier contamination
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Benchmark and gap analysis of current mask carriers vs future requirements: example of the carrier contamination

机译:当前掩模载体的基准和间隙分析与未来要求:载体污染的示例

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In the frame of the European Medea+ 2T302 MUSCLE project, an extensive mask carriers benchmark was carried out in order to evaluate whether some containers answer to the 65nm technology needs. Ten different containers, currently used or expected in the future all along the mask supply chain (blank, maskhouse and fab carriers) were selected at different steps of their life cycle (new, aged, aged&cleaned). The most critical parameters identified for analysis versus future technologies were: automation, particle contamination, chemical contamination (organic outgassing, ionic contamination), cleanability, ESD, airtightness and purgeability. Furthermore, experimental protocols corresponding to suitable methods were then developed and implemented to test each criterion. The benchmark results are presented giving a "state of the art" of mask carriers currently available and allowing a gap analysis for the tested parameters related to future needs. This approach is detailed through the particular case of carrier contamination measurements. Finally, this benchmark/gap analysis leads to propose advisable mask carrier specifications (and the test protocols associated) on various key parameters which can also be taken as guidelines for a standardization perspective for the 65nm technology. This also indicates that none of tested carriers fulfills all the specifications proposed.
机译:在欧洲Medea + 2T302 MUSCLE项目的框架中,进行了广泛的面罩载体基准测试,以评估某些容器是否满足了65nm技术的需求。在面罩供应链的整个生命周期的不同阶段(新的,老化的,老化的和清洁的)选择了十个不同的容器,这些容器目前在面罩供应链中正在使用或将来会使用(空白,掩膜室和晶圆厂运输工具)。针对分析和未来技术确定的最关键参数是:自动化,颗粒污染,化学污染(有机气体,离子污染),可清洁性,ESD,气密性和可净化性。此外,随后开发并实施了与合适方法相对应的实验方案,以测试每个标准。给出了基准结果,给出了当前可用的掩模载体的“最新技术”,并允许对与未来需求相关的测试参数进行间隙分析。通过特定的载体污染测量案例详细介绍了这种方法。最终,这种基准/间隙分析导致针对各种关键参数提出了可取的掩模载体规范(以及相关的测试协议),这些规范也可以作为65nm技术标准化观点的指南。这也表明没有测试过的载波满足所有建议的规格。

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