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The Effect of Intra-field CD Uniformity Control (CDC) on Mask Birefringence

机译:场内CD均匀性控制(CDC)对掩模双折射的影响

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Mask and Wafer CD Uniformity (CDU) improvement by utilizing an ultrafast laser system for writing shading elements inside the bulk of Quartz (Qz) Photomasks has previously been shown to be an effective and practical application . The CD Control ( CDC) Process is working in production environments for 90 and 65 nm design rule processes which utilize KrF and ArF scanners.Advanced design rule nodes at 45 and 32 nm will utilize high and hyper NA immersion lithography, which require highly polarized light and immersion technology. Maintaining a high degree of polarization requires low birefringence (BF) of the optical path and specifically of the mask. Current mask blanks contribute between 5 to 20 nm of BF which is too high for polarized systems. This lead to the recent introduction of special low BF blanks which provide < lnm BF per mask.The CDC Process which introduces an optical element inside the quartz (Qz) mask performs a local change of the bulk Qz morphology which causes a local change in refractive index of the Qz and may induce some local BF. The induced BF, if too high, may potentially cause depolarization of the highly polarized light of hyper NA scanners. Depolarizing the light by a high degree has the potential to degrade the image contrast in the litho process. The current study examined the effect of the CDC Process on the mask BF at 193 nm by writing controlled attenuation shading elements inside special low BF Qz blanks and measuring the BF induced by the CDC Process. Results: It was found that BF induced by the CDC Process is so small that its effect on loss of CDU is negligible compared to the gain in CDU. This will allow mask and IC manufactures to take advantage of Pixer's CDC Process in hyper NA litho processes at 45 and 32 nm nodes.
机译:通过利用超快激光系统在大量石英(Qz)光掩模内部写入阴影元素来改善掩模和晶圆CD的均匀性(CDU),以前已被证明是一种有效而实用的应用。 CD Control(CDC)流程正在使用KrF和ArF扫描仪的90和65 nm设计规则流程的生产环境中工作.45和32 nm的高级设计规则节点将使用高和超NA浸没式光刻技术,这些技术需要高偏振光和浸入技术。保持高度偏振需要光路,特别是掩模的低双折射(BF)。当前的掩模坯料贡献了5到20 nm的BF,这对于偏振系统来说太高了。这导致最近推出了特殊的低BF坯料,每个掩模提供BF≤1nm.CDC工艺将光学元件引入石英(Qz)掩模内,从而改变了整体Qz形貌,从而导致了折射的局部变化。指数,可能会诱发一些局部BF。如果感应的BF太高,则可能会导致hyper NA扫描仪的高偏振光去偏振。在光刻过程中,高度去偏振的光有可能降低图像对比度。当前的研究通过在特殊的低BF Qz坯料内部写入受控衰减阴影元素并测量由CDC流程诱发的BF来检查CDC流程对193 nm掩模BF的影响。结果:发现CDC过程诱导的BF很小,以至于其对CDU损失的影响与CDU的增加相比可忽略不计。这将使掩模和IC制造商在45和32 nm节点的超NA光刻工艺中利用Pixer的CDC工艺。

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