Molding/Encapsulation/Integration Approach for Tactile-Bump And Sensing-Interface of Inductive Tactile Sensor

摘要

This study presents a novel molding/encapsulation/integration approach to realize tactile-bump and sensing-interface for the inductive tactile sensor (Figs.1a-b). Two sensing-interfaces are available using wafer-level silicon molding for proposed tactile sensor: (1) chrome steel ball encapsulated in polymer tactile bump (Fig. 1a), (2) MPC (Magnetic Polymer Composite) embedded in polymer tactile bump (Fig. 1b). Figs.1c-d show the design and sensing scheme of the proposed inductive tactile sensor. The proposed molding/encapsulation/integration approach offers three merits for the inductive tactile sensor: (1) chrome steel ball self-assembled/fixed in Si cavity for polymer molding, (2) tactile-bump and MPC sensing-interface integrated in Si cavity by polymer molding, and (3) polymers of different properties (e.g.: stiffness, magnetic property) integrated using multi-steps molding processes. The inductive tactile sensor of three different designs is successfully demonstrated.