Theoretical analysis and experimental verification for 3D TGV packaging technology

摘要

This paper deduced the theoretical formula for glass reflow process, which is the critical step of fabricating TGV (Through Glass Via) substrate for wafer level vacuum packaging. The analogy of fluid equation and circuit equation is proposed for deducing process. Parameters of glass reflow process, such as heating treatment time and temperature for a certain width mould et al. were comprised in theoretical model, which significantly influence the reflow speed. Moreover, the theoretical results have been verified by simulation and experiments, showing the feasibility for providing parameters for glass reflow process. Finally, hermetic packaging is performed, indicating the feasibility of the TGV substrate for wafer level hermetic packaging.