Significant developments and trends in embedded substrate and component technologies for power applications

摘要

The digital world is going 3D to increase capability in the same footprint Digital 3D will greatly increase the need for power but not increase the available space to implement it Embedded Substrate technology is a viable path to increase power density Multiple substrate and semiconductor technologies are available at many power levels Both formed and inserted components are available from multiple suppliers Multiple power manufactures are shipping product utilizing embedded technology Less than 5% of the material in the reports has been presented. Contact PSMA to find out how to get a copy.