Central Process Engineering and Equipment (CPE), NXP Semiconductors Malaysia;
Central Process Engineering and Equipment (CPE), NXP Semiconductors Malaysia;
Central Process Engineering and Equipment (CPE), NXP Semiconductors Malaysia;
Package Innovation, NXP Semiconductors Malaysia;
Fish; Wires; Lead; Plasmas; Bonding; Failure analysis; Gold;
机译:各种表面粗糙化方法处理的Ni / Pd / Au-Cu预镀精整引线框架表面结构对包装性能的影响
机译:考虑钢板与混凝土粘结滑移的SCS夹层梁的剪切破坏机理
机译:碳纤维增强塑料(CFRP)/铝(Al)粘结的失效机制在受到低速横向预冲击之后受到轴向后张力的作用
机译:QFN挑战:第二债券改进,消除预镀线框架上的弱针脚(鱼尾)故障机制
机译:镀银和镍/钯基引线框架镀层表面处理的二次引线键合完整性的评估。
机译:粘附理论,债券失败机理及债券改良机制