Fish tail structure of lead frame for semiconductor package

• 1. 双芯片TO-252引线框架及半导体封装器件 [P] . 中国专利： CN109285824A . 2019-01-29
• 2. 双芯片TO-252引线框架及半导体封装器件 [P] . 中国专利： CN208923111U . 2019.05.31
• 3. LEAD FRAME STRUCTURE FOR A SEMICONDUCTOR PACKAGE CAPABLE OF IMPROVING THE INTENSITY OF A LEAD FRAME, A MANUFACTURING METHOD THEREOF, AND A METHOD FOR MANUFACTURING THE SEMICONDUCTOR PACKAGE USING THE SAME [P] . 韩国专利： KR20130023432A . 2013-03-08

  机译： 可提高铅框架强度的半导体封装的引线框架结构，其制造方法以及使用该框架制造半导体封装的方法

• 4. A semiconductor package lead frame having a tape attached to an internal lead and a method of manufacturing a semiconductor package having such a structure [P] . 韩国专利： KR960039319A . 1996-11-25

  机译： 具有附接到内部引线的带的半导体封装引线框架以及具有这种结构的半导体封装的制造方法

• 5. Lead frame structure having blocking surfaces and semiconductor package integrated with the lead frame structure [P] . 美国专利： US7459770B2 . 2008-12-02

  机译： 具有阻挡表面的引线框架结构和与该引线框架结构集成的半导体封装

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