Faculty of Mechanical Engineering, Universiti Teknologi Malaysia, Malaysia;
Faculty of Mechanical Engineering, Universiti Teknologi Malaysia, Malaysia;
Faculty of Mechanical Engineering, Universiti Teknologi Malaysia, Malaysia;
Intel Technology Sdn Bhd, Bayan Lepas Free Industrial Zone, Halaman Kampung Jawa, Bayan Lepas, Pulau Pinang, Malaysia;
Intel Technology Sdn Bhd, Bayan Lepas Free Industrial Zone, Halaman Kampung Jawa, Bayan Lepas, Pulau Pinang, Malaysia;
Department of Mechanical Engineering, Faculty of Engineering, University of Malaya, Malaysia;
Faculty of Mechanical Engineering, Universiti Teknologi Malaysia, Malaysia;
Copper; Surface morphology; Morphology; Surface treatment; Through-silicon vias; Response surface methodology; Strain;
机译:新型电镀液,用于在溅射的阻挡层上化学镀铜
机译:纳米压痕测试下化学沉积铜膜的纳米力学响应和蠕变行为
机译:引入电感耦合等离子体增强偏压溅射镍籽晶层提高了化学镀镍在凸块冶金下的结合强度
机译:纳米狭窄载荷期间化学镀层和溅射铜层的速率依赖性响应
机译:基于基于应力的多层板理论的动态表面荷载作用下的路面响应建模。
机译:薄电解质层下覆铜箔层压板和化学镀镍/浸金印刷电路板的电化学迁移行为
机译:在溅射沉积的Al-Ni合金膜上直接化学镀Ni-P层
机译:用于评估多层板对脉冲载荷的动态响应的降阶模型。