Institute of Microelectronic Materials Technology, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China;
Atmosphere; Capacitors; Lead; Materials; Reliability; Soldering; Tin; Ninf2/inf atmosphere; lead-free; reflow; reliability;
机译:微小01005电容器/ SAC305焊点的回流在保护氛围中
机译:Al_2O_3纳米颗粒的粘合强度增强2220-电容器/ SAC305焊料在裸露和Ni涂覆的铜基材上回流的互连
机译:掺杂Ni纳米粒子对Sn-3.0AG-0.5Cu(SAC305)/cu-2.0BE焊点的微观结构演化与剪切行为的影响
机译:1206电容器/ SAC305焊点在保护气氛中回流的可靠性
机译:SAC305焊点变形行为的晶体可塑性有限元分析。
机译:锡膏合金的可靠性研究以改善表面安装细间距元件的焊点
机译:使用sRs软件的无铅芯片电阻器,芯片电容器和铁氧体片式电感器的焊点可靠性预测
机译:激光回流sn-ag焊点的可靠性