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A novel high performance 40GHz hermetic SMT ceramic package for microwave applications

机译:适用于微波应用的新型高性能40GHz密封SMT陶瓷封装

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摘要

A novel high performance SMT (surface mount-type) ceramic package is proposed in this paper. In order to improve the transmission properties of the package, several key points of the simulation and design technologies for high frequency SMT package are proposed. The package has a surface mount terminal with a coplanar structure. The hermetic SMT package prototype samples are manufactured and measured. The measured results show the return loss below −20dB and the low insertion loss less than 0.6dB in the frequency range from DC to 40GHz. It is confirmed that this surface mount-type package shows high transmission properties as well as high thermal and mechanical reliability.
机译:本文提出了一种新型的高性能SMT(表面贴装型)陶瓷封装。为了提高封装的传输性能,提出了高频SMT封装仿真设计技术的几个关键点。该封装具有带共面结构的表面安装端子。密封的SMT封装原型样品已制造并测量。测量结果表明,在DC至40GHz的频率范围内,回波损耗低于-20dB,低插入损耗小于0.6dB。可以确认的是,该表面安装型封装显示出高传输性能以及高的热和机械可靠性。

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