3D FPGA using high-density interconnect Monolithic Integration

摘要

New 3D technology, called “Monolithic Integration”, offers very dense 3D interconnect capabilities. In this paper, we propose a 3D FPGA architecture with logic-on-memory approach based on this technology. The routing and computation blocks are splitted into two layers where the logic is placed on the top and memory on the bottom. Using extracted values from layout in 14nm FDSOI technology, typical benchmark circuits are evaluated in the VPR5 toolflow. The results show an area reduction of 55% compared to the 2D FPGA. More importantly, due to the lowered routing congestion, the EDP of the 3D FPGA is improved by 47%.