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Numerical simulation of dry and wet oxidation of Silicon by TCAD Sprocess

机译:TCAD S工艺干湿氧化硅的数值模拟

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摘要

The oxide thickness is of great concern today. The basic idea is to grow SiO2 layer on Silicon. The oxide is grown on intrinsic silicon substrate by thermal oxidation i.e., wet oxidation and dry oxidation. The thickness is compared for both the oxidation processes after different oxidation cycles. The capacitance per unit length is also calculated for the oxide growth in above. The percentage oxide thickness is also estimated and the oxide is found to grow more into the substrate with time and number of cycles.
机译:如今,氧化物的厚度非常令人关注。基本思想是在硅上生长SiO 2 层。通过热氧化,即湿氧化和干氧化,在本征硅衬底上生长氧化物。比较不同氧化循环后两种氧化工艺的厚度。对于以上的氧化物生长,还计算了每单位长度的电容。还估计了氧化物厚度的百分比,并且发现氧化物随着时间和循环次数而更多地生长到基底中。

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