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Experimental prototyping of beyond-CMOS nanowire computing fabrics

机译:超越CMOS纳米线计算架构的实验原型

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摘要

Nanoscale 3D-integrated Application Specific ICs (N3ASICs) [1], a computing fabric based on semiconductor nanowire grids, is targeted as a scalable alternative to end-of-the-line CMOS. In contrast to device-centric approaches like CMOS, N3ASIC design choices across device, circuit and architecture levels are geared towards reducing manufacturing requirements while focusing on overall benefits. In this fabric, regular arrays with limited customization imply mitigated overlay precision requirements, novel circuit styles with single-type cross-nanowire FETs eliminate the need for arbitrary fine-grain sizing, doping and routing. In addition, junctionless transistors eliminate the need for stringent control of doping profiles. In this paper, we present theoretical and experimental progress towards realizing a functional N3ASIC prototype with junctionless transistors as active cross-point devices. We first validate this device concept through detailed 3D device simulations. We then present a manufacturing pathway as well as show experimental results demonstrating a proof-of-concept metal-gated junctionless nanowire device and N3ASIC tile structure with sub-30nm nanowires.
机译:纳米级3D集成专用IC(N 3 ASICs)[1]是一种基于半导体纳米线网格的计算结构,旨在作为可扩展的替代端到端CMOS的目标。与诸如CMOS的以设备为中心的方法相反,跨设备,电路和体系结构级别的N 3 ASIC设计选择旨在降低制造要求,同时注重整体优势。在这种结构中,定制受限的常规阵列会降低对重叠精度的要求,采用单类型交叉纳米线FET的新型电路样式消除了对任意细粒度的确定,掺杂和布线的需求。此外,无结晶体管无需严格控制掺杂分布。在本文中,我们介绍了实现以无结晶体管作为有源交叉点器件的功能N 3 ASIC原型的理论和实验进展。我们首先通过详细的3D设备仿真来验证此设备概念。然后,我们介绍了一条制造路径,并展示了实验结果,证明了概念验证的金属门控无结纳米线器件和具有30nm以下纳米线的N 3 ASIC磁贴结构。

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