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Post-bond Testing of the Silicon Interposer and Micro-bumps in 2.5D ICs

机译:2.5D IC中的硅中介层和微型凸块的键合后测试

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2.5D integration is emerging as a precursor to stacked 3D ICs. Since the silicon interposer and micro-bumps in 2.5D integration can suffer from fabrication and assembly defects, post-bond testing is necessary for product qualification. This paper proposes and evaluates an interposer test architecture based on extensions to the IEEE 1149.1 Std. The proposed method enables access to interconnects inside the interposer by probing on the C4 bumps. It provides an effective test method for opens, shorts, and interconnect delay fault in the interposer. Moreover, micro-bumps can be tested through test paths that include dies on the interposer. HSPICE simulation results show that a large range of defects can be detected, diagnosed, and characterized using the proposed approach.
机译:2.5D集成正在成为堆叠3D IC的先驱。由于2.5D集成中的硅中介层和微型凸块可能会遭受制造和组装缺陷的困扰,因此,进行后接合测试对于产品鉴定必不可少。本文提出并评估了基于对IEEE 1149.1 Std的扩展的中介层测试体系结构。所提出的方法能够通过探测C4凸块来访问中介层内部的互连。它为插入器中的开路,短路和互连延迟故障提供了有效的测试方法。此外,可以通过测试路径测试微型凸点,该测试路径包括插入器上的管芯。 HSPICE仿真结果表明,使用所提出的方法可以检测,诊断和表征大量缺陷。

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