首页> 外文会议>2012 Lester Eastman Conference on High Performance Devices. >Investigation of pyroelectric polarization effect on GaN MOS capacitors and field-effect transistors
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Investigation of pyroelectric polarization effect on GaN MOS capacitors and field-effect transistors

机译:热电极化对GaN MOS电容器和场效应晶体管的影响

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We compared the high temperature electrical characteristics of GaN MOS capacitors and MOSC-HEMTs on sapphire, Si and bulk GaN substrates. From the flatband voltage shift of the capacitors, we extracted a pyroelectric voltage coefficient of 7.4×104 V/m-K and 8.5×104 V/m-K for sapphire and bulk GaN substrates. The complex threshold voltage shift of MOS Channel-HEMTs (MOSC-HEMTs) could be due to the combining effect of interface traps and polarization charges. The field-effect mobility is very insensitive to the temperature below 150°C, then changes more rapidly (T−1.59 for sapphire substrate and T0.86 for Si substrate) from 150°C to 250°C, which indicates that it is surface scattering limited at low temperatures and phonon scattering limited at higher temperatures.
机译:我们比较了蓝宝石,Si和块状GaN衬底上GaN MOS电容器和MOSC-HEMT的高温电特性。从电容器的平带电压偏移中,我们提取出蓝宝石和块状GaN的热电电压系数为7.4×10 4 V / mK和8.5×10 4 V / mK基材。 MOS通道HEMT(MOSC-HEMT)的复杂阈值电压偏移可能归因于界面陷阱和极化电荷的组合效应。场效应迁移率对低于150°C的温度非常不敏感,然后从150开始变化更快(蓝宝石衬底的T -1.59 ,硅衬底的T 0.86 ) °C到250°C,这表明在低温下它的表面散射受到限制,而在高温下它的声子散射受到限制。

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